
International Journal of Materials and Structural Integrity
2008 Vol.2 No.1/2
Special Issue on Damage In Electronic Materials
Guest Editor: Dr. Leila J. Ladani
Pages | Title and author(s) |
2-10 | Fracture toughness characterisation of electronic materials and interfacesH. Hosokawa, A.V. Desai, M.A. Haque DOI: 10.1504/IJMSI.2008.018897 |
11-34 | Thermomigration in lead-free solder jointsMohd F. Abdulhamid, Shidong Li, Cemal Basaran DOI: 10.1504/IJMSI.2008.018898 |
35-46 | Impact of miniaturisation on solder joint reliabilityMuge Erinc, Piet J.G. Schreurs, Marc G.D. Geers DOI: 10.1504/IJMSI.2008.018899 |
47-63 | Reliability of PWB microvias for high density package assemblyReza Ghaffarian DOI: 10.1504/IJMSI.2008.018900 |
64-92 | Damage mechanics of solder joints – viscoplasticity, implementation, simulation, and verificationZhengfang Qian DOI: 10.1504/IJMSI.2008.018901 |
93-105 | Effects of radiation damage in GaN and related materialsS.J. Pearton, A.Y. Polyakov DOI: 10.1504/IJMSI.2008.018902 |
106-137 | Thermodynamic framework for coupling of elasto-viscoplasticity and nonlocal anisotropic damage for microelectronics solder alloysRashid K. Abu Al-Rub DOI: 10.1504/IJMSI.2008.018903 |
138-163 | Accelerated aging and thermal-mechanical fatigue modelling of Cu-plated through holes with partial solder fillingDonald F. Susan, Alice C. Kilgo, Michael K. Neilsen, Paul T. Vianco DOI: 10.1504/IJMSI.2008.018904 |
164-172 | Estimating fatigue damage model constants with maximum likelihood methodLeila J. Ladani DOI: 10.1504/IJMSI.2008.018905 |
173-192 | Microstructure evolution based acceleration factor determination for SnAgCu solder joints during thermal cyclingKrishna Tunga, Suresh K. Sitaraman DOI: 10.1504/IJMSI.2008.018906 |