International Journal of Materials and Structural Integrity (IJMSI)

International Journal of Materials and Structural Integrity

2008 Vol.2 No.1/2

Special Issue on Damage In Electronic Materials

Guest Editor: Dr. Leila J. Ladani


Pages Title and author(s)
2-10Fracture toughness characterisation of electronic materials and interfaces
H. Hosokawa, A.V. Desai, M.A. Haque
DOI: 10.1504/IJMSI.2008.018897
11-34Thermomigration in lead-free solder joints
Mohd F. Abdulhamid, Shidong Li, Cemal Basaran
DOI: 10.1504/IJMSI.2008.018898
35-46Impact of miniaturisation on solder joint reliability
Muge Erinc, Piet J.G. Schreurs, Marc G.D. Geers
DOI: 10.1504/IJMSI.2008.018899
47-63Reliability of PWB microvias for high density package assembly
Reza Ghaffarian
DOI: 10.1504/IJMSI.2008.018900
64-92Damage mechanics of solder joints – viscoplasticity, implementation, simulation, and verification
Zhengfang Qian
DOI: 10.1504/IJMSI.2008.018901
93-105Effects of radiation damage in GaN and related materials
S.J. Pearton, A.Y. Polyakov
DOI: 10.1504/IJMSI.2008.018902
106-137Thermodynamic framework for coupling of elasto-viscoplasticity and nonlocal anisotropic damage for microelectronics solder alloys
Rashid K. Abu Al-Rub
DOI: 10.1504/IJMSI.2008.018903
138-163Accelerated aging and thermal-mechanical fatigue modelling of Cu-plated through holes with partial solder filling
Donald F. Susan, Alice C. Kilgo, Michael K. Neilsen, Paul T. Vianco
DOI: 10.1504/IJMSI.2008.018904
164-172Estimating fatigue damage model constants with maximum likelihood method
Leila J. Ladani
DOI: 10.1504/IJMSI.2008.018905
173-192Microstructure evolution based acceleration factor determination for SnAgCu solder joints during thermal cycling
Krishna Tunga, Suresh K. Sitaraman
DOI: 10.1504/IJMSI.2008.018906