Authors: Tsutomu Ohta, Jiwang Yan, Tsunemoto Kuriyagawa, Sunao Kodera, Tomoaki Nakasuji
Addresses: Mitsubishi Electric Corporation, Kamakura Works, 325 Kamimachiya, Kamakura, Kanagawa 247-8520, Japan. ' Department of Nanomechanics, Tohoku University, Aramaki Aoba 6-6-01, Aoba-ku, Sendai 980-8579, Japan. ' Department of Nanomechanics, Tohoku University, Aramaki Aoba 6-6-01, Aoba-ku, Sendai 980-8579, Japan. ' Mitsubishi Electric Corporation, Kamakura Works, 325 Kamimachiya, Kamakura, Kanagawa 247-8520, Japan. ' Mitsubishi Electric Corporation, Manufacturing Engineering Centre, 8-1-1, Tsukaguch-Honmachi, Amagasaki, Hyogo 661-8661, Japan
Abstract: In the manufacturing of infrared optics, grinding is usually used as a premachining process for generating aspherical lens figures on brittle materials such as germanium and silicon before diamond turning or polishing. However, microcracks will be generated in workpiece materials by the grinding process. The subsurface crack depth determines the depth of material removal of the finishing processes and affects the total manufacturing time. In order to minimise the depth of finishing removal, it is important to know the grinding-induced crack depth accurately. In this paper, we attempt to predict the subsurface damage depth by surface profiling techniques. The surface roughness of ground silicon and germanium was measured by a stylus-type profilometer with different stylus geometries and the subsurface crack depth was evaluated using two different methods, namely, small-tool polishing method and slanted-polishing method. The relationship between the surface roughness and the subsurface crack depth was experimentally investigated.
Keywords: silicon; germanium; aspherical lens; diamond turning; grinding; surface roughness; subsurface damage; microcracks; ultraprecision machining; brittle materials; surface profiling; infrared optics; polishing; crack depth.
International Journal of Machining and Machinability of Materials, 2007 Vol.2 No.1, pp.108 - 124
Published online: 06 Mar 2007 *Full-text access for editors Full-text access for subscribers Purchase this article Comment on this article