Analysis of surface and subsurface damage of micro-ground BK7 glass using on machine fabricated PCD micro-tool Online publication date: Wed, 30-Jul-2014
by Asma Perveen; M. Rahman; Y.S. Wong
International Journal of Abrasive Technology (IJAT), Vol. 5, No. 1, 2012
Abstract: This paper presents the research results of the morphology of subsurface damage (SSD) in BK7 glass ground with on-machine fabricated PCD micro tool. Grinding generated damages are assessed and characterised using bonding interface sectioning technique combined with field emission scanning electron microscopy (FESEM). Both the damage depth and surface roughness are found to be influenced by the depth of cut, feed rate and spindle speed. Two major type of grinding damage have been identified likely chipping damage and micro-cracking damage. Lateral, median and cone cracks are found to be existed in the sub-surface. These crack size varies from below to above 1 µm. The mechanism of damage nucleation and propagation are discussed also. Although the machined surface seems to show ductile mode behaviour even at higher material removal, analysis of subsurface damage shows that the material removal is a combined effect of grain dislodgement, micro-cracking and plastic deformation.
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Abrasive Technology (IJAT):
Login with your Inderscience username and password:
Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.
If you still need assistance, please email subs@inderscience.com
Our Blog 
Follow us on Twitter 
Visit us on Facebook