The simulation and analysis of stresses field of ceramic die in wire drawing process
by Xue-Feng Yang, Xiang-Bo Ze, Hong-Yan Wang, Hui Wang, Hui Zhang
International Journal of Modelling, Identification and Control (IJMIC), Vol. 7, No. 1, 2009

Abstract: The forces of die are very complicated in factual drawing process, and it is difficult to clearly describe the whole status through formulae. So the stresses distribution and force situation of die are simulated by finite element method in order to research the stresses distribution of ceramic die in drawing process. The simulation environment is established by modelling, loading boundary, solving and visual simulating. The simulation results show that the stresses occur at deformation and invariable zones are very large in the internal hole of die and the disable reasons of die are friction and the wear at the deformation and invariable zones.

Online publication date: Mon, 13-Jul-2009

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