Title: Thermal conductivity and flow properties analysis of nanofluids based on the Lennard-Jones potential model
Authors: Jianfeng Wan; Wenyan Bi
School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo, 454000, China; School of Energy and Power Engineering, University of Shanghai for Science and Technology, Shanghai, 200093, China
School of Physics and Chemistry, Henan Polytechnic University, Jiaozuo, 454000, China; School of Chemical Engineering and Technology, China University of Mining and Technology, Xuzhou, 221000, China
Abstract: Compared with traditional heat transfer fluids, thermal conductivity of nanofluids was greatly increased. The reason was researched with the method of molecular dynamics. To test validity of the model and the algorithms, thermal conductivity of liquid argon at 86 K was studied as simulation examples first. Several different potential energy models had been applied to characterise copper atomic interactions. The first condition simulated with periodic boundary conditions was only one nanoparticle existing in the simulated field which could rule collisions and the aggregation effect of nanoparticles out completely. Second, to study the influence of collisions and aggregation of nanoparticles to thermal conductivity and shear viscosity of nanofluids, the paper simulated conditions in which existed multiple nanoparticles. From the simulation and calculation, it can be concluded that the increase of the thermal conductivity and shear viscosity is different with type of aggregates formed by nanoparticles.
Keywords: nanofluids; thermal conductivity; shear viscosity; Lennard-Jones potential model; molecular dynamics; periodic boundary conditions; PBCs; simulation; flow properties; nanotechnology; nanoparticles.
Int. J. of Nanomanufacturing, 2013 Vol.9, No.3/4, pp.330 - 337
Submission date: 07 Oct 2012
Date of acceptance: 16 Feb 2013
Available online: 29 Aug 2013