Wheel wear mechanisms for silicon grinding: a literature review Online publication date: Tue, 10-Feb-2009
by J.H. Liu, Z.J. Pei, Graham R. Fisher
International Journal of Machining and Machinability of Materials (IJMMM), Vol. 5, No. 1, 2009
Abstract: Grinding is an important flattening process for manufacturing of silicon wafers. The wear of grinding wheels has significant impacts on the manufacturing cost of silicon wafers and the quality of ground wafers. However, a thorough literature search has not resulted in any studies on wheel wear mechanisms in silicon grinding. The lack of understanding and knowledge about wheel wear mechanisms in silicon grinding has become a major barrier to the development of better wheels for the silicon wafer industry. This paper reviews the literature on the wear mechanisms for conventional wheels when grinding metals and for diamond wheels when grinding ceramics, aiming to provide a springboard for research on wheel wear mechanisms when grinding silicon wafers. It covers the types of wheel wear mechanisms, measurement methods for the wheel wear mechanisms, models constructed to study the wear mechanisms and feasibility of applying/extending them to silicon grinding. It concludes with a discussion on the challenges of conducting the research on wheel wear mechanisms in silicon grinding.
Online publication date: Tue, 10-Feb-2009
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Machining and Machinability of Materials (IJMMM):
Login with your Inderscience username and password:
Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.
If you still need assistance, please email email@example.com