Numerical investigation on the thermal reliability and layout optimisation of printed circuit board level Online publication date: Thu, 18-Sep-2014
by Tao Xi; Xingang Yu; Xifu Song; Jian Liu; Xiuwen Yang; Yanfang Zhao; Liqiang Zhang; Ping Yang
International Journal of Materials and Structural Integrity (IJMSI), Vol. 6, No. 2/3/4, 2012
Abstract: The reliability of printed circuit board level is investigated through the optimisation of layout, power and heat dissipating. Different models of AMD HD5550 circuit module are built with different parameters combination based on computational fluid dynamics (CFD) theory. The thermal structures of these models are simulated by FLOTHERM. The result shows that thermal layout has a significant effect on the thermal reliability of the modules. The thickness of heat sink substrate also affects the temperature distribution of the board. The method and result supply a theoretical reference value for thermal design of the printed circuit board level.
Online publication date: Thu, 18-Sep-2014
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