Elasto-plastic characterisation of low-temperature plasma-deposited silicon nitride thin films using nanoindentation Online publication date: Wed, 01-Apr-2009
by Mariusz Martyniuk, Charles A. Musca, John M. Dell, Robert G. Elliman, Lorenzo Faraone
International Journal of Surface Science and Engineering (IJSURFSE), Vol. 3, No. 1/2, 2009
Abstract: Nanoindentation has been utilised in order to investigate the mechanical properties of low-temperature (50-300°C) plasma-deposited SiNx thin films for applications of micro-electro-mechanical systems on temperature sensitive, non-standard substrates. It is found that films deposited at higher temperatures are suitable for these applications, in contrast to films deposited at lower temperatures which tend to have much lower values of Young's modulus and hardness, as well as exhibit significant surface roughness, porosity, and creep. The correlation of SiNx mechanical properties with deposition temperature is shown to be associated with thin film atomic composition and details of the deposition process.
Online publication date: Wed, 01-Apr-2009
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