A non-probe/lithography approach to nanotrench/nanochannel fabrication
by Xueyuan Nie, Efstathios I. Meletis
International Journal of Nanomanufacturing (IJNM), Vol. 2, No. 1/2, 2008

Abstract: We have developed a new nanochannel/nanotrench fabrication technique by combining multi-bilayer Physical Vapour Deposition (PVD) with layer-selective etching on cross-section of the layers. By using this technique, we have successfully fabricated a long array of 35 nm-wide channels separated by 10 nm-wide walls without the need for probe/lithography. The initially designed deposition process determines the desired pattern feature sizes, while the etching process is only to reveal the pattern and determines the trench depth. The significant freedom in materials usage for the nanochannels, given by the PVD method, can provide the nanostructures with a wide property and functionality variety. The simplicity, CMOS compatibility and cost-effectiveness of the method may also be of significant benefit.

Online publication date: Sat, 19-Apr-2008

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