Analysing inspection frequency for wafer bumping process and an empirical study of UNISON decision framework
by Chen-Fu Chien, Chih-Han Hu, Chi-Yung Lin
International Journal of Manufacturing Technology and Management (IJMTM), Vol. 14, No. 1/2, 2008

Abstract: This study aims to develop a UNISON decision framework for analysing the inspection frequency decisions for the advanced wafer bumping process. Since the accumulated values of the wafers fabricated in wafer fabs are high, process excursion and defects in bumping will cause serious loss. Thus, it is critical to determine the inspection frequency to fulfil the requirement of mass production while ensuring the yield. For validation, an empirical study was conducted in a bumping company and the results showed practical viability of the proposed approach.

Online publication date: Wed, 12-Mar-2008

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