Title: Analysing inspection frequency for wafer bumping process and an empirical study of UNISON decision framework
Authors: Chen-Fu Chien, Chih-Han Hu, Chi-Yung Lin
Addresses: Department of Industrial Engineering and Engineering Management, National Tsing Hua University, Hsinchu 30013, Taiwan, ROC. ' Department of Industrial Engineering and Engineering Management, National Tsing Hua University, Hsinchu 30013, Taiwan, ROC. ' Merck Display Technologies Ltd., Kuanyin Industrial Park, Taoyuan Hsien, Taiwan, ROC
Abstract: This study aims to develop a UNISON decision framework for analysing the inspection frequency decisions for the advanced wafer bumping process. Since the accumulated values of the wafers fabricated in wafer fabs are high, process excursion and defects in bumping will cause serious loss. Thus, it is critical to determine the inspection frequency to fulfil the requirement of mass production while ensuring the yield. For validation, an empirical study was conducted in a bumping company and the results showed practical viability of the proposed approach.
Keywords: decision analysis; inspection frequency; wafer bumping; risk analysis; quality engineering; UNISON decision; wafer fabrication.
International Journal of Manufacturing Technology and Management, 2008 Vol.14 No.1/2, pp.130 - 144
Published online: 12 Mar 2008 *Full-text access for editors Access for subscribers Purchase this article Comment on this article