Effect of FAP characteristics on fixed abrasive polishing of CaF2 crystal
by Jun Li; Yongkai Tang; Longlong Song; Yongwei Zhu; Dunwen Zuo
International Journal of Nanomanufacturing (IJNM), Vol. 15, No. 3, 2019

Abstract: Pad is an important factor, which bears pressure to mechanically remove material in chemical mechanical polishing process. Owing to the abrasives fixed in pad, fixed abrasive pad (FAP) becomes more important and influences material removal and surface quality of wafer. The characteristics of FAP, abrasive type, particle size and matrix hardness, were analysed and the effect on material removal rate (MRR) and surface quality was investigated in fixed abrasive polishing of CaF2 crystal. The results indicated that FAP with 3-5 μm diamond abrasive and soft matrix is suited to polish CaF2 crystal. And the better surface quality with surface roughness Sa 7.27 nm and material removal rate 192 nm/min, can be achieved in fixed abrasive polishing of CaF2 crystal.

Online publication date: Fri, 29-Mar-2019

The full text of this article is only available to individual subscribers or to users at subscribing institutions.

 
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.

Pay per view:
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.

Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Nanomanufacturing (IJNM):
Login with your Inderscience username and password:

    Username:        Password:         

Forgotten your password?


Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.

If you still need assistance, please email subs@inderscience.com