Article: Effect of SiO2 nanoparticles on the thermal properties of dielectric composite films Journal: International Journal of Manufacturing Technology and Management (IJMTM) 2016 Vol.30 No.6 pp.410 - 421 Abstract: In order to investigate the influence of SiO2 nanoparticles on the thermal properties of polyimide (PI) composite films, the experimental data of nanocomposite films with changing heat is determined by thermal-gravimetric analysis (TGA) and differential thermal analysis (DTA). The results show that the thermal stability of composite films increases from 500°C to 100°C; the requirement of decomposition heat increases from 30 nw to 60 nw, which is twice as large as the requirement of pure PI; the initial decomposition temperature of composite films is remarkable higher than pure PI and when the weight loss is 5 wt% the temperature increases from 200°C to 520°C, which is 2.5 times. This suggests that adding inorganic nanoparticles can effectively improve the thermal properties of composite film. With increasing content, nanoparticles can form thermal network in the matrix, which is one of important reasons to improve the thermal properties of composite films. Inderscience Publishers - linking academia, business and industry through research

Title: Effect of SiO₂ nanoparticles on the thermal properties of dielectric composite films

Authors: Lei Yao; Lu Chen; Yuqiang Chen; Xiaoxiao Sun

Addresses: Mudanjiang Normal University, No. 19 Wenhua Road, Mudanjiang, Heilongjiang, 157011, China ' Mudanjiang Normal University, No. 19 Wenhua Road, Mudanjiang, Heilongjiang, 157011, China ' Mudanjiang Normal University, No. 19 Wenhua Road, Mudanjiang, Heilongjiang, 157011, China ' Mudanjiang Normal University, No. 19 Wenhua Road, Mudanjiang, Heilongjiang, 157011, China

Abstract: In order to investigate the influence of SiO₂ nanoparticles on the thermal properties of polyimide (PI) composite films, the experimental data of nanocomposite films with changing heat is determined by thermal-gravimetric analysis (TGA) and differential thermal analysis (DTA). The results show that the thermal stability of composite films increases from 500°C to 100°C; the requirement of decomposition heat increases from 30 nw to 60 nw, which is twice as large as the requirement of pure PI; the initial decomposition temperature of composite films is remarkable higher than pure PI and when the weight loss is 5 wt% the temperature increases from 200°C to 520°C, which is 2.5 times. This suggests that adding inorganic nanoparticles can effectively improve the thermal properties of composite film. With increasing content, nanoparticles can form thermal network in the matrix, which is one of important reasons to improve the thermal properties of composite films.

Keywords: SiO2 nanoparticles; silicon dioxide; silica; thermal weight loss; dielectric composite films; polyimide composite films; nanocomposites; nanotechnology; decomposition temperature; inorganic nanoparticles; thermal properties.

DOI: 10.1504/IJMTM.2016.081593

International Journal of Manufacturing Technology and Management, 2016 Vol.30 No.6, pp.410 - 421

Received: 21 Jan 2015
Accepted: 02 Sep 2015
Published online: 17 Jan 2017 *

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Title: Effect of SiO₂ nanoparticles on the thermal properties of dielectric composite films