Authors: Tomáš Homola; Vadym Prysiazhnyi; Monika Stupavská
Addresses: R&D Centre for Low-Cost Plasma and Nanotechnology Surface Modification, Masaryk University, Kotlářská 267/2, 611 37 Brno, Czech Republic ' Faculty of Engineering, Sao Paulo State University, Guaratingueta, SP, Brazil ' R&D Centre for Low-Cost Plasma and Nanotechnology Surface Modification, Masaryk University, Kotlářská 267/2, 611 37 Brno, Czech Republic
Abstract: In this paper, we demonstrated the cleaning and nano-oxidation of Si-wafer surfaces by atmospheric pressure plasma, generated in ambient air using diffuse coplanar surface barrier discharge. Plasma treatment for one second resulted in a significant reduction of water contact angle. The increase in wettability was observed and explained by chemical changes on the analysed Si-wafer surfaces. These changes were analysed by X-ray photoelectron spectroscopy which showed a considerable decrease in the presence of carbon and a significant increase of oxygen on the analysed surfaces.
Keywords: nano-modification; silicon wafers; surface treatment; diffuse plasma; DBD; dielectric barrier discharge; wafer surface modification; nanotechnology; surface cleaning; nano-oxidation; atmospheric pressure plasma; plasma treatment; water contact angle; wettability.
International Journal of Nanomanufacturing, 2015 Vol.11 No.5/6, pp.237 - 244
Received: 08 Apr 2015
Accepted: 05 Jun 2015
Published online: 08 Mar 2016 *