Title: Numerical modelling and experimental implementation of laser shock micro-forming of thin metal sheets

Authors: J.L. Ocaña; M. Morales; J.A. Porro; C. Correa; J.J. García-Ballesteros; O. García

Addresses: Centro Láser UPM, Universidad Politécnica de Madrid, Campus Sur UPM. Ctra. de Valencia, km. 7.3, Madrid 28031, Spain ' Centro Láser UPM, Universidad Politécnica de Madrid, Campus Sur UPM. Ctra. de Valencia, km. 7.3, Madrid 28031, Spain ' Centro Láser UPM, Universidad Politécnica de Madrid, Campus Sur UPM. Ctra. de Valencia, km. 7.3, Madrid 28031, Spain ' Centro Láser UPM, Universidad Politécnica de Madrid, Campus Sur UPM. Ctra. de Valencia, km. 7.3, Madrid 28031, Spain ' Centro Láser UPM, Universidad Politécnica de Madrid, Campus Sur UPM. Ctra. de Valencia, km. 7.3, Madrid 28031, Spain ' Centro Láser UPM, Universidad Politécnica de Madrid, Campus Sur UPM. Ctra. de Valencia, km. 7.3, Madrid 28031, Spain

Abstract: Continuous lasers have been extensively used for macroscopic metal sheet forming. However, for the manufacturing of micro-mechanical systems, the applicability of such type of lasers is limited by the long relaxation time of the thermal fields responsible for the forming phenomena, what makes the generated internal residual stress fields more dependent on ambient conditions. The use of short pulse (ns) lasers provides a suitable parameter matching for the laser forming of an important range of sheet components used in MEMS as the short interaction time in this case allows a faster predominantly mechanical effect. In the present paper, laser shock micro-forming (LSμF) is presented as an emerging technique for microsystems parts shaping and adjustment along with a discussion on its physical foundations and practical implementation possibilities developed by the authors.

Keywords: laser shock processing; LSµF; laser shock microforming; short pulse lasers; shock forming; microsystems shaping; microsystems adjustment; numerical simulation; modelling; thin metal sheets; metal sheet forming; residual stress; MEMS: microelectromechanical systems.

DOI: 10.1504/IJMMP.2015.068314

International Journal of Microstructure and Materials Properties, 2015 Vol.10 No.1, pp.31 - 46

Published online: 29 Mar 2015 *

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