Title: Modelling and electro-hygrothermo-mechanical reliability analyses of leadless dual IC packages

Authors: K. Balaguru; K. Padmanabhan; S. Subeesh

Addresses: Department of Mechanical Engineering, RMK Engineering College, Chennai, Tamil Nadu, 601206 India ' School of Mechanical and Building Sciences, VIT-University, Vellore, Tamil Nadu, 632014 India ' SPEL Semiconductor Ltd., Maraimalai Nagar, Chennai, Tamil Nadu, 603209 India

Abstract: This investigation describes a part of the ongoing activities in the advanced semiconductor materials and packaging collaboration with SPEL Semiconductor Ltd. The aim of the investigation was to generate 3D models of the IC packages, 8L and 12L (8 pin and 12 pin configurations) micro dual leadless moulded packages (µDLMP) in pro-engineer and conduct the performance analysis using the finite element software ANSYS™. Reliability plays a major role at every stage in the manufacturing, testing and use of integrated circuit packages. The influence of operating voltages and joule heating on the mechanical reliability of ICs was also investigated. Die shear tests were conducted on the ICs and the shear strength compared with the values obtained from the finite element results. Thermal tests were carried out on the ICs that were later inspected under a scanning acoustic microscope (SAM) for delaminations arising from hygrothermal stresses. Finally, the results of the electro-hygrothermo-mechanical analyses were analysed and presented at the maximum operating temperature (MOT) that highlight the overall static reliability of the ICs with acceptable factors of safety.

Keywords: micro leadless dual IC packages; dual leadless moulded IC packages; finite element analysis; FEA; static reliability; die-shear test; scanning acoustic microscopy; SAM; modelling; electro-hygrothermo-mechanical reliability; reliability analysis; shear strength; delamination; semiconductor materials; semiconductor packaging.

DOI: 10.1504/IJCAET.2014.063115

International Journal of Computer Aided Engineering and Technology, 2014 Vol.6 No.3, pp.252 - 270

Available online: 03 Jul 2014

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