Title: Simulation of mechanical loading of electronic devices

Authors: Elisabeth Keim

Addresses: Siemens AG, Power Generation, Group KWU, P.O. Box 3220 W-8520 Erlangen, Germany

Abstract: Electronic devices for computers must be tested carefully to guarantee reliable operation. Besides experimental work, numerical methods - in this case the finite-element method (FEM) - offer great advantages because no restrictions concerning size and handling of test machines need be taken into account. For this purpose finite-element calculations are performed to bring out an optimum test configuration for a reliable test of the weakest link of the electronic device. The test piece consists of several materials with various properties, where also material nonlinearities must be considered.

Keywords: electronic devices; finite element method; FEM; solder joints; surface mount technology; SMT; simulation; mechanical loading.

DOI: 10.1504/IJCAT.1992.062600

International Journal of Computer Applications in Technology, 1992 Vol.5 No.2/3/4, pp.169 - 174

Available online: 10 Jun 2014 *

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