Title: The development of a rules-based CAPP system for electronic circuit assembly

Authors: J.X. Gao, G.R. Bennett

Addresses: School of Industrial & Manufacturing Science, Cranfield University, Cranfield, Beds, MK43 OAL, UK. ' British Aerospace Defence Dynamics, Lostock Lane, Lostock, Bolton BL6 4BR, UK

Abstract: There has been a drive within the manufacturing sector to increase productivity and reduce lead times by applying the principles of concurrent engineering and product modelling. Although this has mainly been applied in the area of mechanical engineering, it is equally relevant to electronics design and manufacture. A key element in the application of concurrent engineering and the integration of design and manufacture is the automation of process planning. This paper describes the development of an automated process planning system for electronic assemblies based on a commercially available rules-based document generator. The range of Panel Electronics Circuit (PEC) assembly styles and their characteristics, and the range of equipment and processes to be addressed by planning system, will be described. The method of capturing the manufacturing knowledge will be explained and the business objectives for the system will be defined. The work has been carried out at the British Aerospace Defence Dynamics Manufacturing Centre at Lostock.

Keywords: CADCAM system integration; computer aided process planning; CAPP; concurrent engineering; simultaneous engineering; PCB manufacture; PCB assembly; electronic circuits; electronic assemblies; aerospace industry.

DOI: 10.1504/IJCAT.1998.062215

International Journal of Computer Applications in Technology, 1998 Vol.11 No.6, pp.436 - 441

Published online: 01 Jun 2014 *

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