Title: Design and modelling of silicon MEMS accelerometer

Authors: Meftah Hrairi; Badrul Hanafi Bin Baharom

Addresses: Department of Mechanical Engineering, International Islamic University Malaysia, P.O. Box 10, 50728, Kuala Lumpur, Malaysia ' Department of Mechanical Engineering, International Islamic University Malaysia, P.O. Box 10, 50728, Kuala Lumpur, Malaysia

Abstract: In developing micro electro mechanical systems (MEMS), finite element analysis (FEA) is usually relied upon to study these micro-structures in determining stress, deformation, resonance, temperature distribution, electromagnetic interference, and electrical properties. With this kind of approach, the performance of the devices can be easily expanded, as well as reducing the time and cost of MEMS production. This paper focuses on the modelling of silicon MEMS accelerometer in an attempt to design a surface micro-machined accelerometer that satisfies certain pre-determined specifications.

Keywords: microelectromechanical systems; MEMS; finite element analysis; FEA; accelerometer design; modelling; accelerometer design; modelling; silicon accelerometers; microstructure; surface micromachining; stress; deformation; resonance; temperature distribution; electromagnetic interference; electrical properties.

DOI: 10.1504/IJESMS.2013.056693

International Journal of Engineering Systems Modelling and Simulation, 2013 Vol.5 No.4, pp.181 - 187

Published online: 30 Aug 2014 *

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