Title: Slicing alumina with active braze coating diamond wire

Authors: Pei-Lum Tso; Yong-Ting Chen; Jen-Chen Chuang

Addresses: Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu 300, Taiwan ' Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu 300, Taiwan ' Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu 300, Taiwan

Abstract: This study presents the strong retention of the grains on the resin matrix with active braze coating diamond (ABCD) wire to have longer tool life. There were three kinds of diamond grain of bare diamond, Ni coated diamond, and ABCD in resin-bonding diamond wire saw. In order to discuss the tool life of three kinds of diamond grain, we have developed a technique to determine cutting regime based on the cutting parameters and observation of the chip type. Finally, we found the ABCD grains had strong retention on the resin matrix, so the ABCD wire saw had great tool life.

Keywords: ductile materials; alumina slicing; active braze coating diamond; ABCD wire; brittle materials; diamond wire saw; tool life; diamond grains; resin matrix; cutting parameters; chip type.

DOI: 10.1504/IJAT.2012.052040

International Journal of Abrasive Technology, 2012 Vol.5 No.4, pp.341 - 353

Received: 15 Sep 2012
Accepted: 18 Nov 2012

Published online: 04 Feb 2013 *

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