Title: A numerical approach on life-prediction of solder joints under combined loading for chip packaging system

Authors: Huan Wang; Tao Xi; Xingang Yu; Xifu Song; Xiaoliang Wang; Pei Li; Ping Yang

Addresses: Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS/ODES, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, China. ' Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS/ODES, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, China. ' Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS/ODES, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, China. ' Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS/ODES, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, China. ' Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS/ODES, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, China. ' Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS/ODES, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, China. ' Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS/ODES, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, China

Abstract: The aim of this paper is to provide a numerical approach to predict the lifetime of solder joints by considering combined loading based on the damage superposition. The deformations of solder joints are calculated under vibration and thermal cycling loading respectively. The calculated results are defined as boundary conditions of the multi-axial loading. The strain/stress is investigated by finite element method based on the Chaboche model. The fatigue damage and creep damage are calculated by using the Manson-Coffin equation. It reveals that there is a strong non-linear impact on the lifetime due to the interaction of the combined loading. The trend of the simulation results basically agrees with that of the tests results. The approach can be used to predict the solder joint lifetime under combined loading.

Keywords: thermal cycling loading; vibration loading; solder joints; critical plane; life prediction; finite element method; FEM; chip packaging; solder joint lifetime; damage superposition; deformation; multi-axial loading; stress; strain; fatigue damage; creep damage; combined loading.

DOI: 10.1504/IJMSI.2011.044420

International Journal of Materials and Structural Integrity, 2011 Vol.5 No.4, pp.333 - 347

Published online: 27 Nov 2014 *

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