Title: A novel method for high efficiently lapping of rounded diamond cutting tools

Authors: Z.Q. Li; J.C. Han; W.J. Zong; T. Sun; S. Dong

Addresses: Center for Precision Engineering, Harbin Institute of Technology, Harbin, 150001, China; School of Astronautics, Harbin Institute of Technology, Harbin, 150001, China. ' School of Astronautics, Harbin Institute of Technology, Harbin, 150001, China. ' Center for Precision Engineering, Harbin Institute of Technology, Harbin, 150001, China. ' Center for Precision Engineering, Harbin Institute of Technology, Harbin, 150001, China. ' Center for Precision Engineering, Harbin Institute of Technology, Harbin, 150001, China

Abstract: Rounded diamond cutting tools are widely used in ultra-precision cutting. The lapping quality of nose arc plays a very important role on the accuracy of the machined surface. However, the diamond has strong anisotropy, which is embodied in the nose arc of rounded diamond cutting tools. Therefore, simple cylindrical lapping is not an efficient method to lap the nose arc of the rounded tools. It is urgent to find a best way to lap the nose arc with high precision and efficiency. Firstly, based on periodic bond chain (PBC), a ratio model of material removal rate is built for nose arc of diamond cutting tools. And then, the optimal lapping direction is obtained. Second, two novel lapping methods are proposed according to the formula of material removal amount: one is variation of lapping pressure for uniform material volume removing and the other is variation of lapping time. Lastly, the design criterion for rounded diamond cutting tools is presented. It is recommended to use the tool with crystal plane {110} as rake face and flank face.

Keywords: rounded diamond cutting tools; mechanical lapping; ratio modelling; optimal lapping direction; novel lapping methods; periodic bond chain; material removal rate; MRR.

DOI: 10.1504/IJNM.2011.043686

International Journal of Nanomanufacturing, 2011 Vol.7 No.5/6, pp.463 - 474

Available online: 11 Nov 2011 *

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