Title: Model and solution to the product disassembly sequence planning

Authors: Zhifeng Liu; Di Hu; Bingbing Li

Addresses: School of Mechanical and Automotive Engineering, Hefei University of Technology, Hefei, Anhui 230009, China. ' School of Mechanical and Automotive Engineering, Hefei University of Technology, Hefei, Anhui 230009, China. ' Department of Industrial Engineering, Texas Tech University, Lubbock, Texas 79409, USA

Abstract: Disassembly has been one of the most important content in the product life cycle design. The old Disassembly Sequence Planning (DSP) model takes parts as objective, and does not consider incomplete disassembly, and interacting of different connection relationships of one part. Connection relationship between parts is the objective in this paper, and four constraints during the connection relationship removing process are given. This new model is based on Simulated Annealing Algorithm (SAA). In the case study, a simplified computer mainframe is analysed. The comparison results of two different DSP model show that new model is more effective and accurate.

Keywords: disassembly sequence planning; product disassembly modelling; simulated annealing; product lifecycle design; product design.

DOI: 10.1504/IJETM.2011.043520

International Journal of Environmental Technology and Management, 2011 Vol.14 No.5/6, pp.501 - 515

Received: 04 Nov 2010
Accepted: 16 Aug 2011
Published online: 29 Jan 2015 *

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