Title: Effects of additives W and Ni on microstructure and properties of CuCr25 materials

Authors: Zhang Chengyu, Ding Bingjun

Addresses: School of Material Science and Engineering, Xi'an Jiaotong University, Shaanxi 710049, P. R. China. ' School of Material Science and Engineering, Xi'an Jiaotong University, Shaanxi 710049, P. R. China

Abstract: The CuCr25 materials prepared by vacuum induction melting were investigated in this article. The experimental results show that the additives of W and Ni had significant influences on the microstructure of CuCr25 alloys. The chromium phase of CuCr25 materials containing 1wt% W or 1wt% Ni is dramatically refined. At the same time, the chromium dendrite is restricted, nodular or equiaxed chromium grain is achieved. W can increase the dielectric field of CuCr25 by selectively strengthening Cr phase. The electric conductivity of CuCr25Ni1 reduce due to the dissolution of Ni into the Cu matrix, but still reach the level of conventional CuCr alloys. The other properties of CuCr25Ni1 have not been negatively influenced.

Keywords: CuCr25 materials; inoculants; chromium morphology; dielectric field.

DOI: 10.1504/IJMPT.2004.004260

International Journal of Materials and Product Technology, 2004 Vol.20 No.4, pp.292 - 299

Published online: 10 May 2004 *

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