Title: Performance improvement of chemo-mechanical grinding in single crystal silicon machining by the assistance of elliptical ultrasonic vibration

Authors: Yongbo Wu, Yaguo Li, Zhenzhong Wang, Wei Yang, Libo Zhou

Addresses: Department of Machine Intelligence and Systems Engineering, Akita Prefectural University, 84-4 Tsuchiya-ebinokuchi, Yurihonjo, Akita 015-0055, Japan. ' Department of Machine Intelligence and Systems Engineering, Akita Prefectural University, 84-4 Tsuchiya-ebinokuchi, Yurihonjo, Akita 015-0055, Japan. ' School of Physics and Mechanical and Electrical Engineering, Xiamen University, 420 Siming South Street, Siming District, Xiamen 361005, China. ' School of Physics and Mechanical and Electrical Engineering, Xiamen University, 420 Siming South Street, Siming District, Xiamen 361005, China. ' Department of Intelligent Systems Engineering, Ibaraki University, 4-12-1 Nakanarusawa, Hitachi 316-8511, Japan

Abstract: As a promising technology for the machining of large-sized Si wafer, chemo-mechanical grinding (CMG) integrates the advantages of fixed abrasive machining and chemical mechanical polishing (CMP), and hence can generate superior surface quality comparable to that by CMP while maintaining the high geometric accuracy. In order to enhance the material removal rate (MRR), attain the work-surface with little damage or defects, and then promote the popularisation of CMG, a new combined grinding method, i.e., elliptical ultrasonic vibration assisted CMG (EUA-CMG), is proposed. Some analysis and experiments were conducted to reveal the processing characteristics of EUA-CMG of single crystal silicon. The result shows that compared with the conventional CMG without ultrasonic vibration, better surface quality and higher MRR can be attained in EUA-CMG.

Keywords: elliptical ultrasonic vibration; chemo-mechanical grinding; CMG; material removal rate; MRR; surface quality; single crystal silicon; large silicon wafers.

DOI: 10.1504/IJAT.2011.041607

International Journal of Abrasive Technology, 2011 Vol.4 No.2, pp.117 - 131

Received: 22 Feb 2011
Accepted: 28 Feb 2011

Published online: 27 Sep 2014 *

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