Title: Recent development in modelling and simulation of interfacial heat transfer

Authors: Ningbo Liao, Miao Zhang, Wei Xue

Addresses: College of Mechanical and Electrical Engineering, Wenzhou University, Wenzhou, 325035, China. ' College of Mechanical and Electrical Engineering, Wenzhou University, Wenzhou, 325035, China. ' College of Mechanical and Electrical Engineering, Wenzhou University, Wenzhou, 325035, China

Abstract: For nanoscale devices and structures, interface phenomena often dominate their overall thermal behaviour. Considering the limitations of the continuum mechanics on the characterisation of nanoscale, the atomistic model featuring the interface could be very important in materials design. The purpose of this review is to discuss the applications of modelling and simulation techniques to the interface of dissimilar materials. This paper begins with the state of the art of MD modelling and simulations of materials interface. Next, the current multi-scale methods are introduced and their applications on the study of interfacial heat transfer are discussed. It is concluded that a multi-scales scheme for analysis of heat transfer at interface is needed due to the multi-scale characteristics of interface.

Keywords: molecular dynamics; multiscale modelling; materials interface; interfacial heat transfer; thermomechanical properties; simulation; nanotechnology; dissimilar materials.

DOI: 10.1504/IJMSI.2011.039050

International Journal of Materials and Structural Integrity, 2011 Vol.5 No.1, pp.109 - 114

Published online: 27 Nov 2014 *

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