Title: Stress distribution in bonded joints: an exploration within a mathematical model

Authors: W.A. Lees

Addresses: Technical Director, Permabond Adhesives Limited, Eastleigh, Hamphshire, UK

Abstract: The introduction of |toughened| adhesives with their enhanced capacity to cope with strain has placed increasing emphasis on the importance of mathematical models to be able to cope with the plastic as well as elastic characteristics of adhesives. The changes in stress distribution caused by a variety of modifications to a collar and pin joint have been explored within the framework of an elastic/plastic model. The results indicate quite clearly how important it is to match the adhesive with the adherends and their proposed geometry.

Keywords: adhesives; bonded joints; mathematical modelling; stress distribution.

DOI: 10.1504/IJMPT.1987.036769

International Journal of Materials and Product Technology, 1987 Vol.2 No.2, pp.168 - 181

Available online: 07 Nov 2010 *

Full-text access for editors Access for subscribers Purchase this article Comment on this article