Title: Diffusion bonding of Al₂O₃ with Ti through Ti + TiH₂ interfaces

Authors: Wladyslaw K. Wlosinski

Addresses: Warsaw Technical University, Narbutta 85, PI-02-524 Warsaw, Poland

Abstract: The paper gives the results of work on the technological process of the diffusion bonding of Ti with Al₂O₃, using Ti and TiH₂ powder interfaces. These interfaces were applied in the form of powders with a varying percentage content of Ti in relation to TiH₂. Conditions are described under which the process of bonding was taking place, as well as the effect of these conditions on the interface sintering kinetics. The Al₂O₃ to Ti bonds had no cracks and they featured shear-strength higher than 150 MPa. Results are also given of testing the micro-hardness and microstructure of the joints obtained.

Keywords: diffusion bonding; alumina ceramics; titanium; titanium hydride; alloys; microhardness; thermodynamics; ceramics cracking; powder interfaces; interface sintering kinetics; shear strength; microstructure; joints.

DOI: 10.1504/IJMPT.1995.036447

International Journal of Materials and Product Technology, 1995 Vol.10 No.1/2, pp.152 - 160

Published online: 03 Nov 2010 *

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