Title: Microstructures and HAZ cracking of EB welded Incoloy 903

Authors: M.C. Chaturvedi, N.L. Richards

Addresses: Department of Mechanical and Industrial Engineering, The University of Manitoba, Winnipeg, Manitoba R3T 5V6, Canada. ' Bristol Aerospace Ltd., Winnipeg, Manitoba R3C 2S4, Canada

Abstract: Optical, SEM/EDX and TEM/EDX techniques have been used to characterize the parent, weld and heat affected zone (HAZ) microstructures in electron beam welded (EBW) Incoloy 903. The as-forged microstructure showed a duplex grain size of large warm-worked grains decorated by finer grains. MX carbides, fine MC carbides and MNP phosphides were observed on grain boundaries. The weld metal solidified in a cellular-dendritic mode: with segregation of Nb and Ti to interdendritic regions; no micro-fissures were observed originating in the weld metal. The HAZ, however, showed extensive micro-fissuring, especially on the long warm-worked grain boundaries. The micro-fissuring was attributed to constitutional liquation of the MX carbides (partial), fine MC and MNP phosphides on the grain boundaries. Micro-fissuring was, however, absent on the fine grain boundaries, though the boundaries exhibited a thickened appearance attributed to liquid film migration (LFM). The LFM was found to influence the solidification mode of the grain boundary liquid phase. Liquid solidifying via a non-LFM mode, resulted in a terminal solidification products of γ + MC carbide. These carbides were in extensive sheets along the grain boundary. Areas associated with LFM solidified to a Nb rich austenite and exhibited no evidence of micro-fissuring. The LFM resulted in a smaller solidification temperature range for the grain boundary liquid and resulted in a less sensitive microstructure for the weld cycle thermal stress to act on. LFM was also concluded to be the reason for the beneficial effect of fine grains on minimizing HAZ micro-fissuring.

Keywords: electron beam welding; EBW; heat-affected zone; HAZ; cracking; metallography; superalloys; microstructure; fine grains; microfissures; liquid film migration; solidification; grain boundary.

DOI: 10.1504/IJMPT.1996.036329

International Journal of Materials and Product Technology, 1996 Vol.11 No.3/4, pp.253 - 270

Published online: 02 Nov 2010 *

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