Title: Approach on thermoelectricity reliability of board-level backplane based on the orthogonal experiment design

Authors: Liqiang Zhang, Zhaohua Wu, Xianxin Xu, Haifeng Xu, Yongsheng Wu, Pei Li, Ping Yang

Addresses: Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS/ODES, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, China. ' School of Mechanical and Electrical Engineering of Guilin, University of Electronic Technology, Guilin, 541004, China. ' Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS/ODES, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, China. ' Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS/ODES, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, China. ' Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS/ODES, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, China. ' Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS/ODES, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, China. ' Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS/ODES, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, China

Abstract: The objective of this paper is to provide a systematic investigation to orthogonal experiment design of backplane. The thermoelectricity reliability is systematically investigated by using mixed orthogonal array L9 (3, 4) based on orthogonal experimental design. The experiment results show that the wire width and wire pitch have a significant impact on the thermoelectricity reliability of the backplane, while the wire thickness has an unobtrusive effect. A finite element model of backplane is established based on a sample structure. The results show that the maximum stress occurred in the copper wire, which connected with FR-4 and the polyimide.

Keywords: orthogonal arrays; experimental design; board-level connection; backplane; design parameters; thermoelectricity reliability; stress; wire width; wire pitch; wire thickness; finite element method; FEM; modelling; microelectronics; copper wire.

DOI: 10.1504/IJMSI.2010.035205

International Journal of Materials and Structural Integrity, 2010 Vol.4 No.2/3/4, pp.170 - 185

Published online: 14 Sep 2010 *

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