Title: Effects of current density on copper nanoparticle prepared by electrochemical method
Authors: Jianlin Xu, Jidong Chen, Shuhua Yang, Lihui Zhang, Jianbang Lu
Addresses: State Key Laboratory of Gansu Advanced Non-Ferrous Metal Materials, Lanzhou University of Technology, Lanzhou 730050, China; Key Laboratory of Non-Ferrous Metal Alloys and Processing, The Ministry of Education, Lanzhou University of Technology, Lanzhou 730050, China. ' ShaoXing Testing Institute of Quality Technical Supervision, ShaoXing 312017, China. ' State Key Laboratory of Gansu Advanced Non-Ferrous Metal Materials, Lanzhou University of Technology, Lanzhou 730050, China. ' State Key Laboratory of Gansu Advanced Non-Ferrous Metal Materials, Lanzhou University of Technology, Lanzhou 730050, China. ' Heat Treatment Workshop of Forging Plant, China National Erzhong Group Co., Deyang 618000, China
Abstract: Copper nanoparticles are prepared by electrochemical method with various current density in emulsion containing sodium dodecyl sulfate, tween80, dodecyl mercaptan, CuSO4•5H2O. The resulting copper nanoparticles are investigated by XRD, TEM and FT-IR. The result shows that great changes have taken place in the size, the dispersibility, and the distribution of particles size as the current density goes up. According to analysis, it can be found that the copper nanoparticle can be obtained in smaller size, better dispersibility and narrower distribution of particle size under the current density of 0.01 A/cm². At the same time, current density eventually affects the size of the nanoparticles as well as overpotential and the size of water droplet.
Keywords: current density; copper nanoparticles; emulsion; electrochemical deposition; nanotechnology; particle size.
International Journal of Nanoparticles, 2010 Vol.3 No.2, pp.93 - 103
Received: 06 Jan 2010
Accepted: 19 Feb 2010
Published online: 25 Aug 2010 *