Title: System design and simulation of constant temperature box using semiconductor refrigeration device

Authors: Hui Zhang, Kuang-Chao Fan, Jun Wang

Addresses: The School of Instrument Science and Opto-electronic Engineering, P.O. Box 1#, Hefei University of Technology, Anhui 230009, China. ' The School of Instrument Science and Opto-electronic Engineering, P.O. Box 1#, Hefei University of Technology, Anhui 230009, China; The Department of Mechanical Engineering, National Taiwan University, Taipei, China. ' The School of Instrument Science and Opto-electronic Engineering, P.O. Box 1#, Hefei University of Technology, Anhui 230009, China

Abstract: This paper presents the variation law of temperature in three-dimensional space, which is cooled by the refrigeration provided by the cold side of a semiconductor. The mathematical model of the temperature field of the semiconductor refrigeration device is described, and a numerical study on the temperature profile in a semiconductor refrigeration device was carried out using this model. The problems in the present thermostated containers are discussed, the factor influencing current air organisation and temperature field are analysed. The experimental results show that forced convection is of benefit to the cold transfer and to the rise of refrigeration rate.

Keywords: semiconductor refrigeration; constant temperature box; mathematical modelling; numerical simulation; system design; forced convection.

DOI: 10.1504/IJCAT.2010.032203

International Journal of Computer Applications in Technology, 2010 Vol.37 No.2, pp.146 - 152

Published online: 16 Mar 2010 *

Full-text access for editors Access for subscribers Purchase this article Comment on this article