Authors: Mustafa Calis, Omar Laghrouche, Marc Desmulliez
Addresses: Corac Group plc, Brunel Science Park, Uxbridge UB8 3PQ, UK; MicroSystems Engineering Centre (MISEC), School of Engineering and Physical Sciences, Heriot-Watt University, Edinburgh EH14 4AS, UK. ' School of the Built Environment, Heriot-Watt University, Edinburgh EH14 4AS, UK. ' MicroSystems Engineering Centre (MISEC), School of Engineering and Physical Sciences, Heriot-Watt University, Edinburgh EH14 4AS, UK
Abstract: The rapidly growing micro-electro-mechanical system (MEMS) market is currently estimated at $5 billion and forecasted for 2010 to reach over $12 billion (McWilliams, 2006). MEMS technology, however, is still based on traditional design tools borrowed from microelectronics design with a product development cycle relying on the well tried design-build-test concept. This article presents a software package based on simulation driven development cycle which integrates Cosserat theory into haptic sensing technology. The use of Cosserat theory leads to a reduction of the complexity of the modelling and thus increases its capability for real-time simulation which is indispensable for haptic technologies. The incorporation of Cosserat theory into haptic sensing technology enables the designer to allow virtual manufacturing and prototyping. This article demonstrates the feasibility of the proposed model. In that respect, a cantilever microbeam and microbridge undergoing real-time bending in virtual reality environment are presented.
Keywords: Cosserat theory; elasticity; haptic sensing; MEMS technology; microelectromechanical systems; simulation driven development cycle; virtual reality; miniaturised systems; miniaturisation; microelectronics; product development; design-build-test concept; software packages; real-time simulation; virtual manufacturing; virtual prototyping; cantilever microbeam; microbridges; industrial engineering; systems engineering; responsive manufacturing.
International Journal of Industrial and Systems Engineering, 2010 Vol.5 No.3, pp.366 - 376
Published online: 03 Mar 2010 *Full-text access for editors Access for subscribers Purchase this article Comment on this article