Title: A study of the subsurface damaged layers in nanoscratching

Authors: Jiaxuan Chen, Yingchun Liang, Mingjun Chen, Qingshun Bai, Yulan Tang

Addresses: Center for Precision Engineering, Harbin Institute of Technology, 413#, No. 92, West Da-Zhi Street, Harbin, Heilongjiang, China. ' Center for Precision Engineering, Harbin Institute of Technology, 413#, No. 92, West Da-Zhi Street, Harbin, Heilongjiang, China. ' Center for Precision Engineering, Harbin Institute of Technology, 413#, No. 92, West Da-Zhi Street, Harbin, Heilongjiang, China. ' Center for Precision Engineering, Harbin Institute of Technology, 413#, No. 92, West Da-Zhi Street, Harbin, Heilongjiang, China. ' Municipal and Environment Engineering Institute, Shenyang Jianzhu University, Shenyang 110168, China

Abstract: Molecular dynamics (MD) simulations are carried out to study a three-pyramid tip nanoscratching single crystal copper. The surface integrity and subsurface damaged layers are investigated by the different scratching depths and crystal orientation. The effects show that nanoscratching process results in the extension of the high energy atoms in the subsurface from near the tool to the whole subsurface. The area of high energy atoms in subsurface is basically in consistence with that of the higher residual stress. The ordering degree of subsurface atoms decreases as the increase of scratching depths. The (100) plane body compared to the (111) plane body after scratching process, the numbers of defects in subsurface of the former are more than that of the latter, the surface integrity and the ordering degree of subsurface of the former is better than that of the latter, but the area of the subsurface damaged layers of the former is larger. It is noted that there exists the stack fault in subsurface for the (111) plane body.

Keywords: molecular dynamics; embedded atom method; EAM; subsurface-damaged layers; scratching; energy; residual stress; defects; dislocation; ordering degree; crystal orientation; slip vector; subsurface damage; simulation; nanoscratching; single crystal copper; nanotechnology; surface integrity.

DOI: 10.1504/IJAT.2009.029095

International Journal of Abrasive Technology, 2009 Vol.2 No.4, pp.368 - 381

Available online: 03 Nov 2009 *

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