Title: Finite element analysis on stress/strain in CBGA solder joint with different substrates under thermal cycle
Authors: Yang Ping, Caijun Shen
Addresses: Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS, School of Mechanical Engineering, Jiangsu University, Zhenjiang-212013, PR China. ' Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS, School of Mechanical Engineering, Jiangsu University, Zhenjiang-212013, PR China
Abstract: In this paper, visco-plastic constitutive Anand equation model was used to investigate the behaviour of SnPb solder. A two-dimensional model was built to simulate the working characteristics of soldered joint structure in CBGA by using finite element method. In the meantime, some different kinds of substrates (for example Al2O3, ALN, SiC, BeO) were selected to investigate the mechanical behaviour such as stress/strain process of the solder under thermal cycle. The results shown the maximum stress and strain occurred at the outermost solder. The maximum stress occurred at lowest temperature and hardly decreased with ramp time. The results of finite element analysis also shown the solder have the minimum stress/strain when choose BeO as substrate.
Keywords: CBGA; stress; strain; substrate; FEM; finite element method; ceramic BGA; ball grid arrays; PCBs; printed circuit boards; tin-lead solder; joint soldering; thermal cycle.
International Journal of Manufacturing Technology and Management, 2009 Vol.18 No.3, pp.333 - 339
Published online: 09 Jun 2009 *Full-text access for editors Access for subscribers Purchase this article Comment on this article