Title: Characterisations of interfacial heat transfer by atomic modelling

Authors: Ningbo Liao, Yang Ping

Addresses: Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS, Jiangsu University, Zhenjiang, 212013, PR China. ' Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS, Jiangsu University, Zhenjiang, 212013, PR China

Abstract: An atomic model is proposed for interfacial thermal conductance of dissimilar materials. The simulations results show that the temperature distribution is non-uniform alone the interface, several places corresponding to large temperature difference and sever plastic deformation. By the comparative study, the Cu-Cu interface is built up, it is concluded that the characteristic of atoms| moving alone the interface is caused by dissimilarity of material, which reveal the damage mechanics at the interface in heat transfer. The present atomic model was computationally efficient for interfacial thermal conductance problems. It build a basis for investigation of other interfacial behaviours of dissimilar materials.

Keywords: molecular dynamics; heat transfer; interface; atomic modelling; simulation; interfacial thermal conductivity; dissimilar materials.

DOI: 10.1504/IJMPT.2009.024667

International Journal of Materials and Product Technology, 2009 Vol.34 No.3, pp.352 - 359

Published online: 14 Apr 2009 *

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