Title: Investigation on the thermal conductivity of AlN thin films by using Molecular Dynamics simulation

Authors: Yang Ping, Min Shen, Ningbo Liao

Addresses: Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS, School of Mechanical Engineering, Jiangsu University, Zhenjiang 212013, PR China. ' Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS, School of Mechanical Engineering, Jiangsu University, Zhenjiang 212013, PR China. ' Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS, School of Mechanical Engineering, Jiangsu University, Zhenjiang 212013, PR China

Abstract: In order to investigate high thermal property of AlN ceramic, the Equilibrium Molecular Dynamics (EMD) was used to simulate the thermal conductivity of Aluminum Nitride (AlN) films. The average temperature was selected within 20-4000 K in the simulation. The Stillinger–Weber potential and Green–Kubo|s formula were introduced to calculate thermal conductivity. The results show that the thermal conductivity of the thin films is much lower than that of its bulk counterpart, and the size-effect on thermal conductivity is significant.

Keywords: thermal conductivity; thin films; simulation; molecular dynamics; phonon; aluminium nitride; AlN ceramics.

DOI: 10.1504/IJMPT.2009.024664

International Journal of Materials and Product Technology, 2009 Vol.34 No.3, pp.323 - 329

Published online: 14 Apr 2009 *

Full-text access for editors Full-text access for subscribers Purchase this article Comment on this article