Authors: M.J. Jackson
Addresses: Centre for Advanced Manufacturing, College of Technology, Purdue University, 401 North Grant Street, West Lafayette, Indiana IN 47907, USA
Abstract: Micromachining of semiconductor materials is of critical importance to electronic industries that rely on the removal of material from single crystals. Traditional methods use grinding and polishing techniques to remove material with variable material removal rates. In this paper, the process of pulsed water drop machining is explained along with the development of a tetrahedral machine tool that specifically absorbs dynamic and regenerative vibrations that prevent microcracks from expanding during the micromachining operation. The paper also explains the nature of impact damage and reveals the beneficial effect of the nature of the Rayleigh wave that allows material to be removed from the surface of the substrate material, in this case single crystal materials.
Keywords: micromachining; single crystals; lithium fluoride; fracture; tetrahedral machining centres; semiconductor materials; pulsed water drop machining; microcracks; impact damage.
International Journal of Materials Engineering Innovation, 2009 Vol.1 No.1, pp.107 - 115
Published online: 24 Mar 2009 *Full-text access for editors Access for subscribers Purchase this article Comment on this article