Micromachining single crystal materials using a tetrahedral space frame machining centre
by M.J. Jackson
International Journal of Materials Engineering Innovation (IJMATEI), Vol. 1, No. 1, 2009

Abstract: Micromachining of semiconductor materials is of critical importance to electronic industries that rely on the removal of material from single crystals. Traditional methods use grinding and polishing techniques to remove material with variable material removal rates. In this paper, the process of pulsed water drop machining is explained along with the development of a tetrahedral machine tool that specifically absorbs dynamic and regenerative vibrations that prevent microcracks from expanding during the micromachining operation. The paper also explains the nature of impact damage and reveals the beneficial effect of the nature of the Rayleigh wave that allows material to be removed from the surface of the substrate material, in this case single crystal materials.

Online publication date: Tue, 24-Mar-2009

The full text of this article is only available to individual subscribers or to users at subscribing institutions.

 
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.

Pay per view:
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.

Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Materials Engineering Innovation (IJMATEI):
Login with your Inderscience username and password:

Username:        Password:          Forgotten your password?

Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.

If you still need assistance, please email subs@inderscience.com