Title: Wear of ceramic and resin-bonded diamond particles grinding polycrystalline compacted diamond
Authors: M.J. Jackson, Haiyan H. Zhang, Xiaofu Zhang
Addresses: Centre for Advanced Manufacturing, College of Technology, Purdue University, 401 North Grant Street, West Lafayette, Indiana, IN 47907-2021, USA. ' Centre for Advanced Manufacturing, College of Technology, Purdue University, 401 North Grant Street, West Lafayette, Indiana, IN 47907-2021, USA. ' School of Materials Science and Engineering, Central South University, Changsha 410083, P.R. China
Abstract: The advantages of grinding polycrystalline diamond compacts (PCD) by vitrified bonded and resin bonded diamond grinding wheels are compared. The research shows that the vitrified bonded diamond grinding wheel, which uses titanium plated diamond grains and a glass ceramic bond reduces grinding costs by 35%, grinding duration by 40% and improves precision of size of the PCD compact from ± 30 µm to ± 10 µm. However, when grinding feed exceeds 100 µm; the grinding ratio decreases rapidly.
Keywords: coatings; sintering; thin films; wear; polycrystalline diamond compacts; PD; diamond grinding wheels; vitrified bond; resin bond; titanium plated; glass ceramic bond; PCD.
International Journal of Machining and Machinability of Materials, 2009 Vol.5 No.1, pp.129 - 134
Published online: 10 Feb 2009 *Full-text access for editors Access for subscribers Purchase this article Comment on this article