Title: Lithia-rich vitrified bonded diamond grinding wheels for grinding polycrystalline diamond tools
Authors: Mark J. Jackson, Haiyan H. Zhang, Xiaofu Zhang
Addresses: Center for Advanced Manufacturing, MET, College of Technology, Purdue University, 401 North Grant Street, West Lafayette, Indiana, IN 47907-2021, USA. ' Center for Advanced Manufacturing, MET, College of Technology, Purdue University, 401 North Grant Street, West Lafayette, Indiana, IN 47907-2021, USA. ' School of Materials Science and Engineering, Central South University, Changsha 410083, P.R.China
Abstract: A vitrified bond based on the Li2O-Al2O3-SiO2 glass ceramic system was used to bond diamond grains to form a grinding wheel capable of grinding polycrystalline diamond compacts (PDC). Several factors that influence the properties of the grinding wheel such as the quantity of vitrified bond and the type of filler in the grinding wheel were investigated. It was found that the vitrified bond can firmly combine diamond grains in the structure of grinding wheel and improve the longevity of the grinding wheel by approximately 2.5-3 times compared to resin bonded grinding wheels when processing PDC. The amount of vitrified bond in the grinding wheel influences the longevity of grinding wheel. When the size of diamond grains is between 90 and 107 µm, the optimum amount of vitrified bond in the grinding wheel is 21 wt%. When the amount of vitrified bond exceeds 21%, an increase in the number and size of pores in the grinding wheels produced decreases the longevity of the grinding wheel. The existence of additional filler material such as Al2O3, or SiC, can reduce the longevity of the grinding wheel.
Keywords: polycrystalline diamond compact; PDC; PCD tools; vitrified bond; diamond grinding wheels; abrasive fillers; glass ceramic systems; grinding wheel life.
International Journal of Machining and Machinability of Materials, 2009 Vol.5 No.1, pp.97 - 106
Published online: 10 Feb 2009 *Full-text access for editors Access for subscribers Purchase this article Comment on this article