Title: Numerical investigation on dynamic characteristics of BGA structural integrity by using finite element method

Authors: Zixia Chen, Ping Yang

Addresses: Laboratory of Advanced Design, Manufacturing and Reliability for MEMS/NEMS, Jiangsu University, Zhenjiang, 212013, PR China. ' Laboratory of Materials and Micro-Structural Integrity, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, PR China

Abstract: A specified plastic ball grid array (PBGA) structural integrity prototype which contains different structure and material parameters is designed and manufactured. Based on investigation of the structural and dynamic parameters of PBGA prototype, the numerical simulation of the dynamic characteristics of the PBGA assembly prototype is analysed by using finite element method. The results show that the changing trends of the dynamic modal characteristics during the dynamic excitation. It builds a basis for future work such as the experimental test, structural design and reliability evaluation of PBGA packaging.

Keywords: plastic BGAs; ball grid arrays; BGA assembly; dynamic behaviour; modal analysis; numerical simulation; structural integrity; finite element method; FEM; structural design; reliability evaluation; PBGA packaging.

DOI: 10.1504/IJMSI.2008.020722

International Journal of Materials and Structural Integrity, 2008 Vol.2 No.3, pp.280 - 290

Published online: 12 Oct 2008 *

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