Title: Molecular dynamics simulation of effect of grinding wheel stiffness on nanogrinding process

Authors: Jun Shimizu, Libo Zhou, Hiroshi Eda

Addresses: Department of Intelligent Systems Engineering, Ibaraki University, 4-12-1 Nakanarusawa, Hitachi 316-8511, Japan. ' Department of Intelligent Systems Engineering, Ibaraki University, 4-12-1 Nakanarusawa, Hitachi 316-8511, Japan. ' Department of Intelligent Systems Engineering, Ibaraki University, 4-12-1 Nakanarusawa, Hitachi 316-8511, Japan

Abstract: This paper intends to address an approach of Molecular Dynamics (MD) simulation to clarify the material deformation and removal mechanism between an abrasive grain and workpiece. The workpiece and the abrasive grain are assumed to consist of mono-crystalline copper and rigid diamond, respectively. In the present simulation model, influence of the stiffness of grinding wheel or polishing pad is taken into consideration. From the simulation results, relationships between material removal process and dynamics of the slip deformation, influence of the grinding wheel stiffness on the chip formation process and the actual depth of cut and so on, are clarified. These results indicate that the MD simulation has an advantage in deciding the stiffness of the tools and in estimating the actual depth of cut.

Keywords: molecular dynamics; simulation; grinding wheels; spring constant; depth of cut; rubbing; cutting; stick-slip; grinding wheel stiffness; nanogrinding; material deformation; material removal; abrasive grain; copper; diamond; chip formation.

DOI: 10.1504/IJAT.2008.020565

International Journal of Abrasive Technology, 2008 Vol.1 No.3/4, pp.316 - 326

Available online: 30 Sep 2008 *

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