Title: Research on parametric analysis for stress of Plastic Ball Grid Array solder joint under shock load
Authors: Yang Ping, Zhang Jie, Wu Dongyang, Bao Binghao
Addresses: School of Mechanical Engineering, Jiangsu University, Zhengjiang, 212013, PR China. ' School of Mechanical Engineering, Jiangsu University, Zhengjiang, 212013, PR China. ' Hunan Biological and Electromechanical Polytechnic, Changsha, China. ' School of Mechanical Engineering, Jiangsu University, Zhengjiang, 212013, PR China
Abstract: The dynamic response of a Plastic Ball Grid Array (PBGA) assembly under high acceleration load was investigated. Several influencing factors on solder joint stress were studied by using ANSYS. The results indicate that the location of the solder joint is the most important factor and that the outmost solder balls of the PBGA experience maximum stresses. The solder joint height, the modulus of Ball Grid Array (BGA) have little effect on the stress. The peak stress can be reduced effectively by increasing the diameter of the solder joints, reducing the modulus of the solder joint materials.
Keywords: plastic ball grid arrays; PBGA assembly; shock loads; solder joints; stress; parametric analysis; ANSYS; solder joint location.
DOI: 10.1504/IJMPT.2008.018027
International Journal of Materials and Product Technology, 2008 Vol.31 No.2/3/4, pp.293 - 304
Published online: 27 Apr 2008 *
Full-text access for editors Full-text access for subscribers Purchase this article Comment on this article