Authors: Waqar Ahmed, Mohammed Amar, Htet Sein, Howard Taylor, Riccardo Polini, Mark J. Jackson
Addresses: School of Computing, Technology and Physical Sciences, University of Central Lancashire, Preston PR1 2HE, UK. ' Department of Chemistry and Materials, Manchester Metropolitan University, Chester Street, Manchester M1 5GD, UK. ' Department of Chemistry and Materials, Manchester Metropolitan University, Chester Street, Manchester M1 5GD, UK. ' Department of Chemistry and Materials, Manchester Metropolitan University, Chester Street, Manchester M1 5GD, UK. ' Dipartimento di Scienze e Technologie Chimiche, Universita di Roma 'Tor Vegarta', Roma 00s133, Italy. ' Center for Advanced Manufacturing, MET, College of Technology, Purdue University, 401 North Grant Street, West Lafayette, IN 47907-2021, USA
Abstract: The deposition of diamond films to steel substrates is a highly desirable goal that enhances the performance, wear resistance and reduce the coefficient of friction in engineering components and tools. Unfortunately, due to the high temperatures used in Hot Filament Chemical Vapour Deposition (HFCVD), deposition of diamond films to steel substrates is problematic due to the high rate of diffusion of carbon into steel substrates. These effects inhibit nucleation of diamond and subsequent growth to steel substrates. One method of overcoming such problems and improving nucleation and adhesion of diamond films is to deposit a diffusion barrier between the diamond film and steel substrate to prevent carbon from diffusing. Diamond-seeded TiN layers show some promise in becoming an effective method of depositing polycrystalline diamond films to the steel substrates.
Keywords: chemical vapour deposition; CVD; high speed steel; HSS; TiN; diamond film deposition; titanium nitride; steel substrates; polycrystalline diamond films.
International Journal of Nano and Biomaterials, 2008 Vol.1 No.3, pp.351 - 363
Available online: 26 Jan 2008 *Full-text access for editors Access for subscribers Purchase this article Comment on this article