Authors: Giacomo Paci, Francesco Poletti, Luca Benini, Paul Marchal
Addresses: DEIS – Department of Electronics, Computer Science and Systems, University of Bologna, Italy. ' DEIS – Department of Electronics, Computer Science and Systems, University of Bologna, Italy. ' DEIS – Department of Electronics, Computer Science and Systems, University of Bologna, Italy. ' IMEC – Interuniversity MicroElectronics Center, Leuven, Belgium
Abstract: The power density in high performance systems continues to rise with every process technology generation, thereby increasing the operating temperature and creating |hot spots| on the die. As a result, the performance, reliability and power consumption of the system degrade. To avoid these |hot spots|, |temperature-aware| design has become a must. For low-power embedded systems though, it is not clear whether similar thermal problems occur. These systems have very different characteristics from the high performance ones: e.g., they consume 100 times less power. Therefore, we provide in this paper guidelines to delimit the conditions for which temperature-aware design is needed.
Keywords: MPSoC; thermal modelling; low power processors; hot spots; temperature aware design; silicon bulk technology; power density; embedded systems; multiprocessor system-on-a-chip.
International Journal of Embedded Systems, 2007 Vol.3 No.1/2, pp.43 - 51
Available online: 02 Dec 2007 *Full-text access for editors Access for subscribers Purchase this article Comment on this article