Title: The surface quality of monocrystalline silicon cutting using fixed abrasive diamond endless wire saw

Authors: J.F. Meng, P.Q. Ge, J.F. Li

Addresses: School of Mechanical Engineering, Shandong University, Jinan, P.R. China. ' School of Mechanical Engineering, Shandong University, Jinan, P.R. China. ' School of Mechanical Engineering, Shandong University, Jinan, P.R. China

Abstract: This paper investigates the cutting of monocrystalline silicon using a fixed abrasive diamond endless wire. The cut surface of monocrystalline silicon is studied. The higher the wire speed, the better the surface quality and monocrystalline silicon was removed in a brittle regime mainly. The effects of wire speed and feed rate on the surface roughness are investigated. This study demonstrates the advantage of fixed abrasive diamond endless wire cutting of monocrystalline silicon.

Keywords: cutting; endless wire saw; monocrystalline silicon; surface quality; fixed abrasive diamond wire; wire speed; feed rate; surface roughness.

DOI: 10.1504/IJCAT.2007.015265

International Journal of Computer Applications in Technology, 2007 Vol.29 No.2/3/4, pp.208 - 211

Published online: 30 Sep 2007 *

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