Title: Theoretical model of thermal contact conductance considering electron and phonon conduction in broad temperatures

Authors: Duk Hyung Lee; Myung Su Kim; Dong-Hyun Kim; Yeon Suk Choi

Addresses: Division of Scientific Instrument, Korea Basic Science Institute, 169-148, Gwahak-ro, Yuseong-gu, Daejeon, South Korea; Department of Physics, Chungbuk National University, Cheongju 361-763, South Korea ' Division of Scientific Instrument, Korea Basic Science Institute, 169-148, Gwahak-ro, Yuseong-gu, Daejeon, South Korea ' Department of Physics, Chungbuk National University, Cheongju 361-763, South Korea ' Division of Scientific Instrument, Korea Basic Science Institute, 169-148, Gwahak-ro, Yuseong-gu, Daejeon, South Korea

Abstract: This study presents a thermal contact conductance (TCC) model that improves predictive accuracy across a wide temperature range, particularly in the region above the peak in thermal conductivity. In conduction cooled cryogenic systems that include current leads or resistive thermal components, heat is generated internally or transferred from external sources, requiring accurate estimation of TCC. Copper, a commonly used thermal conductor in such systems, exhibits nonlinear thermal conductivity with temperature, which makes precise prediction of TCC challenging, especially near and beyond the conductivity peak. The proposed model builds upon the Cooper-Mikic-Yovanovich (CMY) formulation by incorporating mechanical contact parameters along with thermophysical influences, such as size effects and heat carrier behaviour, through a modified thermal conductivity expression. The model was assessed using previously reported experimental data for oxygen-free high conductivity copper interfaces. Compared to conventional approaches, it demonstrates a significant reduction in deviation from measured values across the full temperature range, with improved agreement in the post-peak region of thermal conductivity.

Keywords: thermal contact conductance; contact resistance; theoretical model; broad temperature; heat carrier; physical property.

DOI: 10.1504/IJNT.2025.152232

International Journal of Nanotechnology, 2025 Vol.22 No.1, pp.58 - 67

Published online: 11 Mar 2026 *

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