Title: Fabrication of thin film platinum electrodes for resistance temperature detector

Authors: Thang Minh Bui; Vi Nhat Hoang Ngo; Linh Duy Nguyen; Dung My Thi Dang; Tin Chanh Duc Doan; Chien Mau Dang

Addresses: Institute for Nanotechnology, Community 6, Linh Trung Ward, Thu Duc City, Ho Chi Minh City, 700000, Vietnam; Vietnam National University Ho Chi Minh City, Community 6, Linh Trung Ward, Thu Duc City, Ho Chi Minh City, 700000, Vietnam ' Institute for Nanotechnology, Community 6, Linh Trung Ward, Thu Duc City, Ho Chi Minh City, 700000, Vietnam; Vietnam National University Ho Chi Minh City, Community 6, Linh Trung Ward, Thu Duc City, Ho Chi Minh City, 700000, Vietnam ' Institute for Nanotechnology, Community 6, Linh Trung Ward, Thu Duc City, Ho Chi Minh City, 700000, Vietnam; Vietnam National University Ho Chi Minh City, Community 6, Linh Trung Ward, Thu Duc City, Ho Chi Minh City, 700000, Vietnam ' Institute for Nanotechnology, Community 6, Linh Trung Ward, Thu Duc City, Ho Chi Minh City, 700000, Vietnam; Vietnam National University Ho Chi Minh City, Community 6, Linh Trung Ward, Thu Duc City, Ho Chi Minh City, 700000, Vietnam ' Institute for Nanotechnology, Community 6, Linh Trung Ward, Thu Duc City, Ho Chi Minh City, 700000, Vietnam; Vietnam National University Ho Chi Minh City, Community 6, Linh Trung Ward, Thu Duc City, Ho Chi Minh City, 700000, Vietnam ' Institute for Nanotechnology, Community 6, Linh Trung Ward, Thu Duc City, Ho Chi Minh City, 700000, Vietnam; Vietnam National University Ho Chi Minh City, Community 6, Linh Trung Ward, Thu Duc City, Ho Chi Minh City, 700000, Vietnam

Abstract: Micro fabrication technology plays a crucial role in the development of the semiconductor industry. The advantages of integrated circuits lie in their small size and superior properties of the fabricated components/electrodes, saving production materials and consuming less energy. Various photoresist materials can be used in photolithography to fabricate electrodes using integrated circuit technology. This study focuses on the use of PCB photoresist as part of the photolithography process to fabricate thin-film platinum electrodes for resistance temperature detectors (RTDs). Platinum electrodes were fabricated using the DC magnetron sputtering method with a 55 mm long wire, 377 μm wide, and 200 nm thick, demonstrating the most accurate linear variation in thermal resistance. The measured values are very close to the regression line, as well as stable time-repeating values. This demonstrates the potential application of PCB photoresists in the semiconductor industry in order to reduce production costs.

Keywords: photolithography; electrodes; MEMS; micro-electro-mechanical systems; photoresist PCB; thermal electrode.

DOI: 10.1504/IJNT.2024.146455

International Journal of Nanotechnology, 2024 Vol.21 No.7/8/9/10/11/12, pp.513 - 523

Published online: 30 May 2025 *

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