Title: Thermal contact resistance measurement between EXG and polyimide substrates under varying pressure and thermal interfacial material

Authors: Gwan-Yong Choi; Ho-Sung Kim; Dong-Wook Oh

Addresses: Department of Mechanical Engineering, Chosun University, 309, Pilmundaero, Donggu, Gwangju 61452, South Korea ' Department of Mechanical Engineering, Chosun University, 309, Pilmundaero, Donggu, Gwangju 61452, South Korea ' Department of Mechanical Engineering, Chosun University, 309, Pilmundaero, Donggu, Gwangju 61452, South Korea

Abstract: In this study, we conducted an experimental analysis of the thermal contact resistance between Eagle XG (EXG) glass and polyimide substrates using the bi-directional 3ω method. The 3ω sensors were fabricated on either an EXG or a polyimide film. The same material as the sensor substrate was placed on the sensor, and the thermal contact resistance in between the sensor and the sample was measured with the applied pressure and the thermal interfacial material (TIM). The experimental results revealed decreased thermal contact resistance with increasing applied pressure on the substrate and the sample. Moreover, applying a droplet of ethylene glycol at the interface effectively reduced the thermal contact resistance compared to applying pressure alone. Furthermore, when ethylene glycol was used as the TIM, the measurement error of the thermal conductivities of the sample EXG and polyimide film became negligible at 15 MPa and 30 MPa of applied pressure, respectively.

Keywords: 3ω method; thermal contact resistance; TIM; thermal interfacial material; applied pressure.

DOI: 10.1504/IJNT.2024.137413

International Journal of Nanotechnology, 2024 Vol.21 No.3, pp.148 - 156

Published online: 18 Mar 2024 *

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